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1. general description the 74hc1g126 and 74hct1g126 are high-speed, si-gate cmos devices. they provide one non-inverting buffer/line driver with 3-state output. the 3-state output is controlled by the output enable input pin (oe). a low at pin oe causes the output as assume a high-impedance off-state. the hc device has cmos input switching levels and supply voltage range 2 v to 6 v. the hct device has ttl input switching levels and supply voltage range 4.5 v to 5.5 v. the bus driver output currents are equal to those of the 74hc126 and 74hct126. 2. features n symmetrical output impedance n high noise immunity n low power dissipation n balanced propagation delays n sot353-1 and sot753 package options 3. ordering information 4. marking 74hc1g126; 74hct1g126 bus buffer/line driver; 3-state rev. 04 20 july 2007 product data sheet table 1. ordering information type number package temperature range name description version 74hc1g126gw - 40 c to +125 c tssop5 plastic thin shrink small outline package; 5 leads; body width 1.25 mm sot353-1 74hct1g126gw 74HC1G126GV - 40 c to +125 c sc-74a plastic surface-mounted package; 5 leads sot753 74hct1g126gv table 2. marking codes type number marking 74hc1g126gw hn 74hct1g126gw tn 74HC1G126GV h26 74hct1g126gv t26
74hc_hct1g126_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 20 july 2007 2 of 12 nxp semiconductors 74hc1g126; 74hct1g126 bus buffer/line driver; 3-state 5. functional diagram 6. pinning information 6.1 pinning 6.2 pin description 7. functional description fig 1. logic symbol fig 2. iec logic symbol fig 3. logic diagram mna125 a oe y 2 1 4 mna126 1 4 oe 2 mna127 oe a y fig 4. pin con?guration 74hc1g126 74hct1g126 oe v cc a gnd y 001aaf103 1 2 3 5 4 table 3. pin description symbol pin description oe 1 output enable input a 2 data input gnd 3 ground (0 v) y 4 data output v cc 5 supply voltage table 4. function table h = high voltage level; l = low voltage level; x = dont care; z = high-impedance off-state inputs output oe a y hl l hhh lxz
74hc_hct1g126_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 20 july 2007 3 of 12 nxp semiconductors 74hc1g126; 74hct1g126 bus buffer/line driver; 3-state 8. limiting values [1] the input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] above 55 c the value of p tot derates linearly with 2.5 mw/k. 9. recommended operating conditions 10. static characteristics table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). [1] symbol parameter conditions min max unit v cc supply voltage - 0.5 +7.0 v i ik input clamping current v i < - 0.5 v or v i >v cc + 0.5 v - 20 ma i ok output clamping current v o < - 0.5 v or v o >v cc + 0.5 v - 20 ma i o output current - 0.5 v < v o 74hc_hct1g126_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 20 july 2007 4 of 12 nxp semiconductors 74hc1g126; 74hct1g126 bus buffer/line driver; 3-state v oh high-level output voltage v i = v ih or v il i o = - 20 m a; v cc = 2.0 v 1.9 2.0 - 1.9 - v i o = - 20 m a; v cc = 4.5 v 4.4 4.5 - 4.4 - v i o = - 20 m a; v cc = 6.0 v 5.9 6.0 - 5.9 - v i o = - 6.0 ma; v cc = 4.5 v 3.84 4.32 - 3.7 - v i o = - 7.8 ma; v cc = 6.0 v 5.34 5.81 - 5.2 - v v ol low-level output voltage v i = v ih or v il i o = 20 m a; v cc = 2.0 v - 0 0.1 - 0.1 v i o = 20 m a; v cc = 4.5 v - 0 0.1 - 0.1 v i o = 20 m a; v cc = 6.0 v - 0 0.1 - 0.1 v i o = 6.0 ma; v cc = 4.5 v - 0.15 0.33 - 0.4 v i o = 7.8 ma; v cc = 6.0 v - 0.16 0.33 - 0.4 v i i input leakage current v i =v cc or gnd; v cc = 6.0 v - - 1.0 - 1.0 m a i oz off-state output current v i = v ih or v il ; v o = v cc or gnd; v cc = 6.0 v --5 - 10 m a i cc supply current v i =v cc or gnd; i o =0a; v cc = 6.0 v - - 10 - 20 m a c i input capacitance - 1.5 - - - pf for type 74hct1g126 v ih high-level input voltage v cc = 4.5 v to 5.5 v 2.0 1.6 - 2.0 - v v il low-level input voltage v cc = 4.5 v to 5.5 v - 1.2 0.8 - 0.8 v v oh high-level output voltage v i = v ih or v il ; v cc = 4.5 v i o = - 20 m a 4.4 4.5 - 4.4 - v i o = - 6.0 ma 3.84 4.32 - 3.7 - v v ol low-level output voltage v i = v ih or v il ; v cc = 4.5 v i o = 20 m a - 0 0.1 - 0.1 v i o = 6.0 ma - 0.16 0.33 - 0.4 v i i input leakage current v i =v cc or gnd; v cc = 5.5 v - - 1.0 - 1.0 m a i oz off-state output current v i = v ih or v il ; v o = v cc or gnd; v cc = 5.5 v --5 - 10 i cc supply current v i =v cc or gnd; i o =0a; v cc = 5.5 v - - 10 - 20 m a d i cc additional supply current per input; v cc = 4.5 v to 5.5 v; v i =v cc - 2.1 v; i o =0a - - 500 - 850 m a c i input capacitance - 1.5 - - - pf table 7. static characteristics continued voltages are referenced to gnd (ground = 0 v). all typical values are measured at t amb =25 c. symbol parameter conditions - 40 c to +85 c - 40 c to +125 c unit min typ max min max
74hc_hct1g126_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 20 july 2007 5 of 12 nxp semiconductors 74hc1g126; 74hct1g126 bus buffer/line driver; 3-state 11. dynamic characteristics [1] t pd is the same as t plh and t phl . t en is the same as t pzl and t pzh . t dis is the same as t plz and t phz . [2] c pd is used to determine the dynamic power dissipation p d ( m w). p d =c pd v cc 2 f i + ? (c l v cc 2 f o ) where: f i = input frequency in mhz f o = output frequency in mhz c l = output load capacitance in pf v cc = supply voltage in volts ? (c l v cc 2 f o ) = sum of outputs table 8. dynamic characteristics gnd = 0 v; t r = t f 6.0 ns; c l = 50 pf unless otherwise speci?ed. all typical values are measured at t amb =25 c. for test circuit see figure 7 symbol parameter conditions - 40 c to +85 c - 40 c to +125 c unit min typ max min max for type 74hc1g126 t pd propagation delay a to y; see figure 5 [1] v cc = 2.0 v - 24 125 - 150 ns v cc = 4.5 v - 10 25 - 30 ns v cc = 5.0 v; c l =15pf - 9 - - - ns v cc = 6.0 v - 9 21 - 26 ns t en enable time oe to y; see figure 6 [1] v cc = 2.0 v - 24 155 - 190 ns v cc = 4.5 v - 10 31 - 38 ns v cc = 6.0 v - 8 26 - 32 ns t dis disable time oe to y; see figure 6 [1] v cc = 2.0 v - 16 155 - 190 ns v cc = 4.5 v - 12 31 - 38 ns v cc = 6.0 v - 11 26 - 32 ns c pd power dissipation capacitance v i = gnd to v cc [2] -30- - -pf for type 74hct1g126 t pd propagation delay a to y; see figure 5 [1] v cc = 4.5 v - 11 30 - 36 ns v cc = 5.0 v; c l =15pf - 10 - - - ns t en enable time oe to y; see figure 6 ; v cc = 4.5 v [1] - 10 35 - 42 ns t dis disable time oe to y; see figure 6 ; v cc = 4.5 v [1] - 12 31 - 38 ns c pd power dissipation capacitance v i = gnd to v cc - 1.5 v [2] -27- - -pf
74hc_hct1g126_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 20 july 2007 6 of 12 nxp semiconductors 74hc1g126; 74hct1g126 bus buffer/line driver; 3-state 12. waveforms measurement points are given in t ab le 9 . fig 5. the input (a) to output (y) propagation delays mna121 a input y output t phl t plh gnd v i v m v m measurement points are given in t ab le 9 . fig 6. the 3-state enable and disable times mna129 t plz t phz output disabled output enabled v oh - 0.3 v v ol + 0.3 v output enabled output low-to-off off-to-low output high-to-off off-to-high oe input v i v cc v m gnd gnd t pzl t pzh v m v m table 9. measurement points type input output v m v i v m 74hc1g126 0.5 v cc gnd to v cc 0.5 v cc 74hct1g126 1.3 v gnd to 3.0 v 1.3 v
74hc_hct1g126_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 20 july 2007 7 of 12 nxp semiconductors 74hc1g126; 74hct1g126 bus buffer/line driver; 3-state test data is given in t ab le 8 . de?nitions for test circuit: r t = termination resistance should be equal to the output impedance z o of the pulse generator c l = load capacitance including jig and probe capacitance r l = load resistance for t plh , t phl , s 1 = open for t plz , t pzl , s 1 = v cc for t phz , t pzh , s 1 = gnd fig 7. load circuitry for switching times open gnd v cc v cc v i v o mna232 d.u.t. c l r t r l = 1000 w pulse generator s 1
74hc_hct1g126_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 20 july 2007 8 of 12 nxp semiconductors 74hc1g126; 74hct1g126 bus buffer/line driver; 3-state 13. package outline fig 8. package outline sot353-1 (tssop5) unit a 1 a max. a 2 a 3 b p l h e l p wy v ce d (1) e (1) z (1) q references outline version european projection issue date iec jedec jeita mm 0.1 0 1.0 0.8 0.30 0.15 0.25 0.08 2.25 1.85 1.35 1.15 0.65 e 1 1.3 2.25 2.0 0.60 0.15 7 0 0.1 0.1 0.3 0.425 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 0.46 0.21 sot353-1 mo-203 sc-88a 00-09-01 03-02-19 w m b p d z e e 1 0.15 13 5 4 q a a 2 a 1 l p (a 3 ) detail x l h e e c v m a x a y 1.5 3 mm 0 scale tssop5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm sot353-1 1.1
74hc_hct1g126_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 20 july 2007 9 of 12 nxp semiconductors 74hc1g126; 74hct1g126 bus buffer/line driver; 3-state fig 9. package outline sot753 (sc-74a) references outline version european projection issue date iec jedec jeita sot753 sc-74a wb m b p d e a a 1 l p q detail x h e e v m a a b y 0 1 2 mm scale c x 13 2 4 5 plastic surface-mounted package; 5 leads sot753 unit a 1 b p cd e h e l p qy w v mm 0.100 0.013 0.40 0.25 3.1 2.7 0.26 0.10 1.7 1.3 e 0.95 3.0 2.5 0.2 0.1 0.2 dimensions (mm are the original dimensions) 0.6 0.2 0.33 0.23 a 1.1 0.9 02-04-16 06-03-16
74hc_hct1g126_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 20 july 2007 10 of 12 nxp semiconductors 74hc1g126; 74hct1g126 bus buffer/line driver; 3-state 14. abbreviations 15. revision history table 10. abbreviations acronym description dut device under test ttl transistor-transistor logic table 11. revision history document id release date data sheet status change notice supersedes 74hc_hct1g126_4 20070720 product data sheet - 74hc_hct1g126_3 modi?cations: ? the format of this data sheet has been redesigned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. ? package sot353 changed to sot353-1 in t ab le 1 and figure 8 . ? quick reference data and soldering sections removed. ? section 2 f eatures updated. 74hc_hct1g126_3 20020515 product speci?cation - 74hc_hct1g126_2 74hc_hct1g126_2 20010406 product speci?cation - 74hc_hct1g126 74hc_hct1g126 19970924 preliminary speci?cation - -
74hc_hct1g126_4 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 04 20 july 2007 11 of 12 nxp semiconductors 74hc1g126; 74hct1g126 bus buffer/line driver; 3-state 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 16.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 16.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 16.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 17. contact information for additional information, please visit: http://www .nxp.com for sales of?ce addresses, send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors 74hc1g126; 74hct1g126 bus buffer/line driver; 3-state ? nxp b.v. 2007. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 20 july 2007 document identifier: 74hc_hct1g126_4 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 functional description . . . . . . . . . . . . . . . . . . . 2 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 9 recommended operating conditions. . . . . . . . 3 10 static characteristics. . . . . . . . . . . . . . . . . . . . . 3 11 dynamic characteristics . . . . . . . . . . . . . . . . . . 5 12 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 11 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 16.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 16.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 17 contact information. . . . . . . . . . . . . . . . . . . . . 11 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

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